Rogers RO4003C Dielectric Constant 0.762mm Mid Loss Pcb Material

Rogers RO4003C Dielectric Constant Mid Loss Pcb Material

Quick details:

Material: Rogers 4003C

Board size:9*3CM

Surface finish:Gold plated

Copper weight:1OZ

Number of layer:2

Solder mask:No

Rogers RO4003C HIGH FREQUENCY PCB 2 Layer 0.762mm Thickness printed circuit boards

Rogers 4003C pcb material in stock:

Rogers4003C: thickness(0.254 0.508,0.813,1.524)   DK 3.38

Rogers4350B: thickness(0.254 0.508,0.762,1.524)   DK 3.5

Rogers5880: thickness(0.254 0.508,0.762)   DK 2.2

Rogers3003: thickness(0.127, 0.508,0.762,1.524)   DK 3

Rogers3010: thickness(0.635)   DK 10.2

Rogers3206: thickness(0.635)   DK 10.2

Rogers3035: thickness(0.508)   DK 3.5

Rogers6010: thickness(0.635,1.27)   DK 10.2

Rogers 4003C Laminate:

Volume production of microwave circuit assemblies requires fast, reliable and effi cient methods of attaching discrete microwave components to the circuit board. These could include simple two-lead devices such as resistors or diodes, or complex multi-lead MICs. Bonding techniques used for conventional epoxy glass grade laminates have been used with limited success on PTFE based laminates. However, conventional epoxy glass grade parameters are generally acceptable for the Rogers RO4000® series high frequency laminates. This application note is intended to present a general guide for device attachment to RT/duroid® and RO4000 high frequency laminates.

RT/duroid Laminate Characteristics RT/duroid laminates are random glass fi ber reinforced PTFE or ceramic fi lled PTFE materials. PTFE is a soft, waxy, thermoplastic fl uoropolymer. The glass or ceramic reinforcement adds dimensional stability and increases the hardness but the laminates are, in general, much softer than the low frequency hardboards, such as glass/epoxy. PTFE is a thermoplastic rather than a thermosetting resin. At elevated temperatures the substrate will readily deform and take a permanent set. Lead attachment methods must therefore minimize the pressure applied to the dielectric, particularly at elevated temperatures.

RO4000® High Frequency Laminate Characteristics RO4350B™ and RO4003C™ high freqeuncy laminates are glass reinforced hydrocarbon/ceramic materials. The laminate is a rigid, highly fi lled thermoset resin system which has a Tg >280°C (536°F). The high Tg helps to maintain the expansion characteristics over a wide range of temperatures. Lead attachment methods are similar to what is practiced with conventional FR4 epoxy grade laminates.

High Frequency Rogers RO4003C Laminates

Typical Applications

High reliability aerospace and defense

A wide range of typical and non-traditional microwave/RF applications

Standard Dielectric Constant:

3.38+-0.05

Standard Thickness

RO4003C: 0.008” (0.203mm), 0.012 (0.305mm),

0.016”(0.406mm), 0.020” (0.508mm) 0.032” (0.813mm), 0.060” (1.524mm)

Standard Panel Size

12” X 18” (305 X457 mm)

24” X 18” (610 X 457 mm)

24” X 36” (610 X 915 mm)

48” X 36” (1.224 m X 915 mm)

Standard Copper Cladding

½ oz. (17μm) electrodeposited copper foil (.5ED/.5ED)

1 oz. (35μm) electrodeposited copper foil (1ED/1ED)

2 oz. (70μm) electrodeposited copper foil (2ED/2ED)

Rogers 4003C datasheet:

What are some other popular materials used for high-frequency PCBs?

In addition to Rogers PCB materials, there are several other popular materials used for high-frequency PCBs. Here are a few examples:

Isola: Isola is a leading manufacturer of high-performance laminate and prepreg materials for PCBs. They offer materials like IS410, IS620, and Astra MT that are specifically designed for high-frequency applications. Isola materials provide excellent electrical properties, low loss, and high thermal reliability.

Taconic: Taconic is another well-known manufacturer of high-frequency PCB materials. Their popular product lines include RF-35, RF-35A, and TLX. These materials offer low dielectric loss, high thermal conductivity, and good mechanical stability, making them suitable for high-frequency and high-power applications.

Arlon: Arlon specializes in high-frequency laminates and prepregs for PCBs. Their product lineup includes materials like 85N, 85HP, and 55NT. Arlon materials have low loss, high thermal conductivity, and good dimensional stability, making them suitable for applications requiring high-frequency performance.

Nelco: Nelco, a subsidiary of Park Electrochemical Corp., offers a range of high-frequency PCB materials. Their popular products include N4000-13EP and N7000-2. These materials have low dielectric loss, high glass transition temperature, and good dimensional stability, making them suitable for high-speed digital and RF applications.

Panasonic/Megtron: Panasonic and Megtron (a product line of Panasonic) offer high-performance laminates suitable for high-frequency PCBs. Megtron 6 and Megtron 7 are their popular materials that provide low loss, excellent electrical properties, and high reliability for high-frequency applications.

It's important to note that the selection of materials for high-frequency PCBs depends on the specific application requirements and design considerations. Working with PCB manufacturers and material suppliers experienced in high-frequency designs can help in choosing the right material for a particular application.

Rogers PCB applications.

Moreover, since nowadays 5G Technology developments are growing quickly, various devices request high-frequency PCBs and RF PCBs with high performance which need not only low electrical noise but also low signal losses. And Rogers PCB material is a perfect choice to match the technological characteristics, besides it is also cost-effective for this purpose. Some Rogers PCB applications are:

1 .Automotive Radar and Sensors
2. Microwave equipment of all kinds.
3. Cellular Base Station Antennas
4. RF Identification (RFID) Tags
5. 5G Station
6. Microwave point to point (P2P) links
7. LNB’s for Direct Broadcast Satellites

RT/duriod

Rogers RT/duroid® high-frequency circuit materials are filled PTFE (irregular glass or ceramic) composite coversfor use in high reliability, aviation and defense applications. The RT/duroid types have a long industry nearness of providing high-reliability materials with predominant performance. This kind of material has several benefits:

1 Low electrical loss,
2. Low moisture absorption,
3. Stable dielectric constant (Dk) over a wide frequency range, and
4. Low outgassing for space applications.

RO3000

RO3000 laminates are ceramic filled PTFE composites intended for use in the commercial microwave and RF applications. R03000 series laminates are circuit materials with very consistent mechanical properties regardless of the dielectric constant selected. Due to this characteristic, when designing multi-layer boards with varying dielectric constants, there will be very little issues if any at all The dielectric constant VS temperature of RO3000 series materials is very stable. RO3000 laminates also are available in a wide range of dielectric constants (3.0 to 10.2). The most common applications are:

1. Surface mount RF components,
2.GPS antennas, and
3. Power amplifiers.

RO4000

RO4000 laminates and pre-pregs possess favorable properties that are highly useful in microwave circuits and instances where controlled impedance is needed. This series of laminates are very price optimized and are also fabricated using standard FR4 processes which makes it suitable for multi-layer PCBs. Additionally, it can be processed lead-free. The series of RO4000 laminates offer a range of dielectric constants (2.55-6.15) and are available with UL 94 V-0 flame retardant versions. The most popular applications of this are:

1. RFID chips,
2. Power amplifiers,
3. Automotive radars, and
4. Sensors.

TMM®
Rogers TMM® thermoset microwave laminates fuse dielectric constant uniformity, low thermal coefficient of dielectric constant (Dk), and a copper matched coefficient of thermal expansion. Because of their electrical and mechanical stability, TMM high-frequency laminates are perfect for high-reliability strip-line and micro-strip applications. This kind of material has several benefits:

1. Wide range of dielectric constants (Dks),
2.Excellent mechanical properties, cold flow, and resists creep,
3. Exceptionally low thermal coefficient of Dk,
4. Coefficient of thermal expansion fit to copper taking into account high reliability of plated through-holes,
5. Available copper clad in larger formats, allowing the use of standard PCB subtractive processes,
6. No wreck to materials during fabrication and assembly processes,  Resistant to process chemicals,
7. Thermoset resin for reliable wire bonding,
8. No specialized production techniques required,
9. TMM 10 and 10i laminates can replace alumina substrates, and
10. RoHS compliant, environmentally friendly.Below is a table that shows the characteristics of various types of PCB materials.