RO4350B High Frequency PCB with Dielectric Constants Ranging from 2.2 to 10.6
PCB parameter:
Material: RO4350B
Number of layers: 4
Plate thickness: 0.254mm
Minimum aperture: Mechanical hole 0.2mm,
Minimum line width/line spacing: 0.35mm
Copper thickness: 1OZ each on the inner and outer layers
Solder resistance: green oil with white letters
Surface technology: sinking gold
Top of the line high-frequency material resources, allowing your products to win at the fundamental factory. We have imported and domestic boards with dielectric constants ranging from 2.2 to 10.6. High frequency materials such as Rogers/Rogers, Taconic/Taikonli, Arlon, Isola, F4BM/Wangling, PTFE/PTFE, TP-2, etc., with dielectric constants ranging from 2.2 to 10.6. Rogers series: RogersRO4350B, RO4003C, RT5880, RT5870, RO3003, RO3010, RO4730, RT6006, RT6010, etc
High frequency PCB description:
High-frequency PCB (Printed Circuit Board) refers to a type of PCB that is designed to handle high-frequency signals, typically in the radio frequency (RF) and microwave ranges. These PCBs are engineered to minimize signal loss, maintain signal integrity, and control impedance at high frequencies.
Here are some key considerations and features of high-frequency PCBs:
Material Selection: High-frequency PCBs often use specialized materials with low dielectric constant (Dk) and low dissipation factor (Df). Common materials include PTFE (Polytetrafluoroethylene), FR-4 with enhanced properties, and specialized laminates like Rogers or Taconic.
Controlled Impedance: Maintaining consistent impedance is crucial for high-frequency signals. High-frequency PCBs employ controlled impedance routing, which involves precise trace widths, spacing, and dielectric thickness to achieve the desired characteristic impedance.
Signal Integrity: High-frequency signals are susceptible to noise, reflections, and losses. PCB design techniques such as proper ground plane placement, signal return paths, and controlled crosstalk are employed to minimize signal degradation and maintain signal integrity.
Transmission Lines: High-frequency PCBs often incorporate transmission lines, such as microstrip or stripline, to carry the high-frequency signals. These transmission lines have specific geometries to control impedance and minimize signal loss.
Via Design: Vias can impact signal integrity at high frequencies. High-frequency PCBs may use techniques like back drilling or buried vias to minimize signal reflections and maintain signal integrity across layers.
Component Placement: Careful consideration is given to component placement to minimize signal path lengths, reduce parasitic capacitance and inductance, and optimize signal flow.
Shielding: To minimize electromagnetic interference (EMI) and RF leakage, high-frequency PCBs may employ shielding techniques such as copper pours, ground planes, or metal shielding cans.
High-frequency PCBs find applications in various industries, including wireless communication systems, aerospace, radar systems, satellite communication, medical devices, and high-speed data transmission.
Designing and manufacturing high-frequency PCBs require specialized skills, knowledge, and simulation tools to ensure the desired performance at high frequencies. It is often recommended to work with experienced PCB designers and manufacturers who specialize in high-frequency applications.
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